The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling
| Autor: | Zhong, Ying, Liu, Wei, Wang, Chunqing, Zhao, Xiujuan, Caers, J.F.J.M. |
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| Zdroj: | In Materials Science & Engineering A 15 January 2016 652:264-270 |
| Databáze: | ScienceDirect |
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