The interface bonding mechanism and related mechanical properties of Mg/Al compound materials fabricated by insert molding
| Autor: | Liu, J.C., Hu, J., Nie, X.Y., Li, H.X., Du, Q., Zhang, J.S., Zhuang, L.Z. |
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| Zdroj: | In Materials Science & Engineering A 21 May 2015 635:70-76 |
| Databáze: | ScienceDirect |
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