Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint
| Autor: | Tseng, Chien-Fu, Duh, Jenq-Gong |
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| Zdroj: | In Materials Science & Engineering A 15 September 2013 580:169-174 |
| Databáze: | ScienceDirect |
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