Strengthening mechanism of Ni–Cu nanotwins with void under different tensile directions based on Molecular Dynamics simulation

Autor: Liu, Yun-chun, Liang, Yong-chao, Zhou, Li-li, Gao, Ting-hong, Chen, Qian, Tian, Ze-an
Zdroj: In Physica B: Condensed Matter 1 November 2023 668
Databáze: ScienceDirect