Optimization of highly conductive insert architecture for cooling a rectangular chip
Autor: | Mazloomi, A., Sharifi, F., Salimpour, M.R., Moosavi, A. |
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Zdroj: | In International Communications in Heat and Mass Transfer October 2012 39(8):1265-1271 |
Databáze: | ScienceDirect |
Externí odkaz: |