High-G drop impact response and failure analysis of a chip packaged printed circuit board
| Autor: | Jenq, S.T., Sheu, H.S., Yeh, Chang-Lin, Lai, Yi-Shao, Wu, Jenq-Dah |
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| Zdroj: | In International Journal of Impact Engineering 2007 34(10):1655-1667 |
| Databáze: | ScienceDirect |
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