Enhancing interfacial thermal conductivity of copper-carbon nanotube array composite via metallic bonding: Molecular dynamics simulations
| Autor: | Wang, Xin, Wang, Xueliang, Tong, Yigang, Wang, Yaping |
|---|---|
| Zdroj: | In Chemical Physics 1 August 2024 584 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect