The copper matrix composite with "sandwich" structure and three-dimensional networks, showcasing significantly improved thermal conducting performance
Autor: | Wang, Ziyou, Gao, Xianpeng, Zhang, Mu, Sun, Xudong |
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Zdroj: | In Ceramics International 1 September 2024 50(17) Part B:31097-31106 |
Databáze: | ScienceDirect |
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