High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging

Autor: Chen, Chao, Tang, Yongjun, Ye, Yun Sheng, Xue, Zhigang, Xue, Yang, Xie, Xiaolin, Mai, Yiu-Wing
Zdroj: In Composites Science and Technology 10 December 2014 105:80-85
Databáze: ScienceDirect