The effect of pre-existing voids on solder reliability at different thermomechanical stress Levels: Experimental assessment
| Autor: | Waseem, Abbas, Ibrahim, Mesfin Seid, Lu, Chang, Waseem, Muhammed, Lee, Hiu Hung, Loo, K.H. |
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| Zdroj: | In Materials & Design September 2023 233 |
| Databáze: | ScienceDirect |
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