The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
| Autor: | Ramli, M.I.I., Mohd Salleh, M.A.A., Yasuda, H., Chaiprapa, J., Nogita, K. |
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| Zdroj: | In Materials & Design 15 January 2020 186 |
| Databáze: | ScienceDirect |
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