Influence of intermetallic compounds on the electrical resistivity of architectured copper clad aluminum composites elaborated by a restacking drawing method
| Autor: | Moisy, F., Gueydan, A., Sauvage, X., Guillet, A., Keller, C., Guilmeau, E., Hug, E. |
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| Zdroj: | In Materials & Design 5 October 2018 155:366-374 |
| Databáze: | ScienceDirect |
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