Microstructural evolution and properties of TLP diffusion bonding super-Ni/NiCr laminated composite to Ti-6Al-4V alloy with Cu interlayer
| Autor: | Liu, Kun, Li, Yajiang, Xia, Chunzhi, Wang, Juan |
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| Zdroj: | In Materials & Design 5 December 2017 135:184-196 |
| Databáze: | ScienceDirect |
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