Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder
| Autor: | Maeshima, Takashi, Ikehata, Hideaki, Terui, Kenichirou, Sakamoto, Yoshitsugu |
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| Zdroj: | In Materials & Design 5 August 2016 103:106-113 |
| Databáze: | ScienceDirect |
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