Electrodeposited Sn-Cu-Ni alloys as lead-free solders on copper substrate using deep eutectic solvents: The influence of electrodeposition mode on the morphology, composition and corrosion behaviour
| Autor: | State, Sabrina Patricia, Costovici, Stefania, Mousavi, Mirsajjad, Garcia, Yaiza Gonzalez, Zanella, Caterina, Cojocaru, Anca, Anicai, Liana, Visan, Teodor, Enachescu, Marius |
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| Zdroj: | In Surface & Coatings Technology 15 February 2024 477 |
| Databáze: | ScienceDirect |
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