Thermal evolution, phase composition and fracture toughness of electroless Ni-P, Ni-W-P and Ni-Mo-W-P films for solderable surfaces on copper
| Autor: | Sharma, Tanu, Bera, Holger, Brown, Delilah A., Schulze, Andreas, Brüning, Ralf |
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| Zdroj: | In Surface & Coatings Technology 25 August 2023 467 |
| Databáze: | ScienceDirect |
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