Influence of Pd(P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu multilayer
| Autor: | Lee, C.Y., Yang, S.P., Yang, C.H., Lu, M.K., Kuo, T.T., Ho, C.E. |
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| Zdroj: | In Surface & Coatings Technology 15 August 2020 395 |
| Databáze: | ScienceDirect |
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