TEM characterization of Cu self-annealing and direct proof of pinhole formation mechanism in a Cu film
| Autor: | Ho, C.E., Chen, C.C., Yang, C.H., Lee, P.T., Hsieh, W.Z., Wu, Y.S. |
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| Zdroj: | In Surface & Coatings Technology 25 September 2018 350:1010-1019 |
| Databáze: | ScienceDirect |
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