Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system
| Autor: | Ho, C.E., Fan, C.W., Hsieh, W.Z. |
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| Zdroj: | In Surface & Coatings Technology 25 November 2014 259 Part B:244-251 |
| Databáze: | ScienceDirect |
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