Electromigration in thin-film solder joints
Autor: | Ho, C.E., Yang, C.H., Hsu, L.H. |
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Zdroj: | In Surface & Coatings Technology 25 November 2014 259 Part B:257-261 |
Databáze: | ScienceDirect |
Externí odkaz: |
Autor: | Ho, C.E., Yang, C.H., Hsu, L.H. |
---|---|
Zdroj: | In Surface & Coatings Technology 25 November 2014 259 Part B:257-261 |
Databáze: | ScienceDirect |
Externí odkaz: |