Electroless copper seed layer deposition on tantalum nitride barrier film
| Autor: | Chong, S.P., Ee, Y.C., Chen, Z. *, Law, S.B. |
|---|---|
| Zdroj: | In Surface & Coatings Technology 2005 198(1):287-290 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Chong, S.P., Ee, Y.C., Chen, Z. *, Law, S.B. |
|---|---|
| Zdroj: | In Surface & Coatings Technology 2005 198(1):287-290 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect