Microstructure modification and mechanical reinforcement in sub-10 μm scale Cu/Sn–Ag/Cu microbump joints via Co-addition of Zn and Ni in Cu substrates

Autor:	Lee, Yin-Ku, Wu, Zih-Yu, Huang, Ping-Wei, Tsai, Su-Yueh, Chang, Shou-Yi, Duh, Jenq-Gong
Zdroj:	In Materials Chemistry and Physics 1 November 2024 327
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect