Novel solid-state pressureless approach for Cu-embedded intermetallic interconnects at low temperature
| Autor: | Huang, Kuo-Shuo, Shen, Tzu-Hao, Liu, Wei, Chao, Jui-Lin, Wu, Albert T. |
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| Zdroj: | In Materials Chemistry and Physics 1 November 2021 272 |
| Databáze: | ScienceDirect |
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