Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

Autor: Yakymovych, Andriy, Mudry, Stepan, Shtablavyi, Ihor, Ipser, Herbert
Zdroj: In Materials Chemistry and Physics 15 September 2016 181:470-475
Databáze: ScienceDirect