Growth kinetics of the intermetallic phase in diffusion-soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections
| Autor: | Wierzbicka-Miernik, A., Miernik, K., Wojewoda-Budka, J., Szyszkiewicz, K., Filipek, R., Litynska-Dobrzynska, L., Kodentsov, A., Zieba, P. |
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| Zdroj: | In Materials Chemistry and Physics 15 November 2013 142(2-3):682-685 |
| Databáze: | ScienceDirect |
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