Effect of temperature on microstructural changes of the Sn–9 wt.% Zn lead-free solder stripe under current stressing
| Autor: | Chen, Chih-ming, Hung, Yu-min, Lin, Chi-pu, Su, Wen-Chiung |
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| Zdroj: | In Materials Chemistry and Physics 2009 115(1):367-370 |
| Databáze: | ScienceDirect |
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