Effects of different printed circuit board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued small outline J leads/Sn–Pb interfaces
| Autor: | Huang, Meng-Kuang, Wu, Pei-Lin, Lee, Chiapyng |
|---|---|
| Zdroj: | In Materials Chemistry and Physics 2004 85(1):63-67 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect