Glass-based encapsulant enabling SiC power devices to long-term operate at 300 °C
Autor: | Chen, Junwei, Luo, Tao, Huang, Houbin, Zhang, Liangzhu, Chen, Wei, Qin, Guobing, Fan, Jiajie, Zeng, Huidan |
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Zdroj: | In Applied Surface Science 30 January 2025 680 |
Databáze: | ScienceDirect |
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