Rational utilization of the size and electronic effect of inhibitors enabling high polishing rate with minimum corrosion in copper chemical mechanical polishing
| Autor: | Chang, Pengfei a, Huang, Zisheng a, Chen, Yulong a, Ling, Huiqin a, Wu, Yunwen a, Li, Ming a, Shacham-Diamand, Yosi b, Hang, Tao a, ⁎ |
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| Zdroj: | In Applied Surface Science 15 November 2024 674 |
| Databáze: | ScienceDirect |
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