Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors
| Autor: | Zhao, Shuaijie, Chen, Chuantong, Haga, Motoharu, Ueshima, Minoru, Suganuma, Katsuaki |
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| Zdroj: | In Applied Surface Science 15 January 2023 608 |
| Databáze: | ScienceDirect |
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