Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu
| Autor: | Han, Haneul, Lee, Chaerin, Kim, Youjung, Lee, Jinhyun, Kim, Rosa, Kim, Jongryoul, Yoo, Bongyoung |
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| Zdroj: | In Applied Surface Science 1 June 2021 550 |
| Databáze: | ScienceDirect |
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