Enhancement of bonding strength in BiTe-based thermoelectric modules by electroless nickel, electroless palladium, and immersion gold surface modification
| Autor: | Nguyen, Yen Ngoc, Kim, Subin, Bae, Sung Hwa, Son, Injoon |
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| Zdroj: | In Applied Surface Science 15 April 2021 545 |
| Databáze: | ScienceDirect |
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