Effect of TaN intermediate layer on the back contact reaction of sputter-deposited Cu poor Cu2ZnSnS4 and Mo
| Autor: | Zhuk, Siarhei, Wong, Terence Kin Shun, Tyukalova, Elizaveta, Guchhait, Asim, Seng, Debbie Hwee Leng, Tripathy, Sudhiranjan, Wong, Ten It, Sharma, Mohit, Medina, Henry, Duchamp, Martial, Wong, Lydia Helena, Dalapati, Goutam Kumar |
|---|---|
| Zdroj: | In Applied Surface Science 31 March 2019 471:277-288 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect