Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
| Autor: | Wang, Yuechun, Chen, Xiuhua, Ma, Wenhui, Shang, Yudong, Lei, Zhengtao, Xiang, Fuwei |
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| Zdroj: | In Applied Surface Science 28 February 2017 396:333-338 |
| Databáze: | ScienceDirect |
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