Influence of nickel–phosphorus surface roughness on wettability and pores formation in solder joints for high power electronic applications
| Autor: | Vivet, L., Joudrier, A.-L., Tan, K.-L., Morelle, J.-M., Etcheberry, A., Chalumeau, L. |
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| Zdroj: | In Applied Surface Science 15 December 2013 287:13-21 |
| Databáze: | ScienceDirect |
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