Thermal processing of strained silicon-on-insulator for atomically precise silicon device fabrication
| Autor: | Lee, W.C.T., Bishop, N., Thompson, D.L., Xue, K., Scappucci, G., Cederberg, J.G., Gray, J.K., Han, S.M., Celler, G.K., Carroll, M.S., Simmons, M.Y. |
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| Zdroj: | In Applied Surface Science 15 January 2013 265:833-838 |
| Databáze: | ScienceDirect |
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