Copper filling of deep sub-μm through-holes by high-vacuum planar magnetron sputtering using argon gas with added oxygen
| Autor: | Uhara, Yoshio, Urano, Tsubasa, Itoh, Masatoshi, Hayashi, Hideo, Manba, Yousuke, Taniseki, Akifumi, Jyan, Houin, Nishikawa, Eiichi, Saito, Sigeru |
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| Zdroj: | In Applied Surface Science 2009 256(4):1240-1243 |
| Databáze: | ScienceDirect |
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