ToF-SIMS imaging of Cl at Cu grain boundaries in interconnects for microelectronics
| Autor: | Barnes, J.P., Carreau, V., Maitrejean, S. |
|---|---|
| Zdroj: | In Applied Surface Science 2008 255(4):1564-1568 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
| Autor: | Barnes, J.P., Carreau, V., Maitrejean, S. |
|---|---|
| Zdroj: | In Applied Surface Science 2008 255(4):1564-1568 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect