Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers
| Autor: | Stangl, M. *, Dittel, V., Acker, J., Hoffmann, V., Gruner, W., Strehle, S., Wetzig, K. |
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| Zdroj: | In Applied Surface Science 2005 252(1):158-161 |
| Databáze: | ScienceDirect |
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