Study of interaction between polyimide and Cu under a high humidity condition
Autor: | Nagai, N. *, Hironaka, T., Imai, T., Harada, T., Nishimura, M., Mimori, R., Ishida, H. |
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Zdroj: | In Applied Surface Science 2001 171(1):101-105 |
Databáze: | ScienceDirect |
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