Characterisation of the HEXITEC[formula omitted] X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology
| Autor: | Veale, M.C., Booker, P., Church, I., Jones, L.L., Lipp, J., Schneider, A., Seller, P., Wilson, M.D., Chsherbakov, I., Kolesnikova, I., Lozinskaya, A., Novikov, V., Tolbanov, O., Tyazhev, A., Zarubin, A. |
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| Zdroj: | In Nuclear Inst. and Methods in Physics Research, A 11 February 2022 1025 |
| Databáze: | ScienceDirect |
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