Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
| Autor: | Fritzsch, T., Jordan, R., Oppermann, H., Ehrmann, O., Töpper, M., Baumgartner, T., Lang, K.-D. |
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| Zdroj: | In Nuclear Inst. and Methods in Physics Research, A 2011 650(1):189-193 |
| Databáze: | ScienceDirect |
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