Chemical studies of CVD Cu deposited on Ta and TaN barriers under various process conditions

Autor: Voss, Steve *, Gandikota, Srinivas, Chen, Liang-Yuh, Tao, Rong, Cong, Dennis, Duboust, Alain, Yoshida, Naomi, Ramaswami, Sesh
Zdroj: In Microelectronic Engineering 2000 50(1):501-508
Databáze: ScienceDirect