Adhesion studies of CVD copper metallization
| Autor: | Gandikota, Srinivas *, Voss, Steve, Tao, Rong, Duboust, Alain, Cong, Dennis, Chen, Liang-Yuh, Ramaswami, Sesh, Carl, Daniel |
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| Zdroj: | In Microelectronic Engineering 2000 50(1):547-553 |
| Databáze: | ScienceDirect |
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