Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation

Autor:	Salahouelhadj, A., Gonzalez, M., Vanstreels, K., Van der Plas, G., Beyer, G., Beyne, E.
Zdroj:	In Microelectronic Engineering 1 March 2023 271-272
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect