Bevel contamination management in 3D integration by localized SiO2 deposition
| Autor: | Boulard, F., Gros, V., Porzier, C., Brunet, L., Lapras, V., Fournel, F., Truffier-Boutry, D., Autillo, D., Ruault, P., Keovisai, M., Posseme, N. |
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| Zdroj: | In Microelectronic Engineering 15 September 2022 265 |
| Databáze: | ScienceDirect |
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