Influence of abrasive morphology and size dispersity of Cu barrier metal slurry on removal rates and wafer surface quality in chemical mechanical planarization
| Autor: | Hong, Seungchul, Han, Deoksu, Kwon, Jangkuk, Kim, Sung Jun, Lee, Seong Jae, Jang, Keon-Soo |
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| Zdroj: | In Microelectronic Engineering 15 August 2020 232 |
| Databáze: | ScienceDirect |
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