Processing and integration of graphene in a 200 mm wafer Si technology environment
| Autor: | Lisker, M., Lukosius, M., Fraschke, M., Kitzmann, J., Dabrowski, J., Fursenko, O., Kulse, P., Schulz, K., Krüger, A., Drews, J., Schulze, S., Wolansky, D., Schubert, A.M., Katzer, J., Stolarek, D., Costina, I., Wolff, A., Dziallas, G., Coccetti, F., Mai, A. |
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| Zdroj: | In Microelectronic Engineering 15 January 2019 205:44-52 |
| Databáze: | ScienceDirect |
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