Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques

Autor: Steinberg, Christian, Rumler, Maximilian, Runkel, Manuel, Papenheim, Marc, Wang, Si, Mayer, Andre, Becker, Marco, Rommel, Mathias, Scheer, Hella-Christin
Zdroj: In Microelectronic Engineering 25 May 2017 176:22-27
Databáze: ScienceDirect