Employment of roll-offset printing for fabrication of solder bump arrays: Harnessing the rheological properties of lead-free solder pastes using particle size distribution
| Autor: | Son, Min-Jung, Kim, Inyoung, Yang, Sangsun, Lee, Taik-Min, Lee, Hoo-Jeong |
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| Zdroj: | In Microelectronic Engineering 1 October 2016 164:128-134 |
| Databáze: | ScienceDirect |
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